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| www.fairchildsemi.com FAN1589 2.7A, 1.2V Low Dropout Linear Regulator for VRM8.5 Features * * * * * * Fast transient response Low dropout voltage at up to 2.7A Load regulation: 0.05% typical Trimmed current limit On-chip thermal limiting Standard TO-220, TO-263, TO-263 center cut and TO-252 (DPAK) packages Description The FAN1589 is a low dropout three-terminal regulator with 2.7A output current capability. This device has been optimized for VTT bus termination, where transient response and minimum input voltage are critical. The FAN1589 offers fixed 1.2V with 2.7A current capability for a GTL+ bus VTT termination. Current limit is trimmed to ensure specified output current and controlled short-circuit current. On-chip thermal limiting provides protection against any combination of overload and ambient temperature that would create excessive junction temperatures. The FAN1589 is available in the industry-standard TO-220, TO-263, TO-263 center cut and TO-252 (DPAK) power packages. Applications * A GTL+ bus supply for VRM 8.5 * Low voltage logic supply * Post regulator for switching supply Typical Application FAN1589 VOUT VIN + 10F GND + VIN = 3.3V 1.2V at 2.7A 22F REV. 1.0.3 2/25/02 FAN1589 PRODUCT SPECIFICATION Pin Assignments FAN1589T FRONT VIEW FAN1589M FRONT VIEW Tab is OUT Tab is OUT 1 2 3 1 2 3 GND OUT IN 3-Lead Plastic TO-263 JC = 3C/W* GND OUT IN 3-Lead Plastic TO-220 JC = 3C/W FAN1589MC FRONT VIEW FAN1589D Tab is OUT 1 2 3 123 FRONT VIEW Tab is OUT GND IN GND OUT IN 3-Lead Plastic TO-252 JC = 3C/W* 3-Lead Plastic TO-263 Center Cut JC = 3C/W* *With package soldered to 0.5 square inch copper area over backside ground plane or internal power plane, JA can vary from 30C/W to more than 40C/W. Other mounting techniques can provide a thermal resistance lower than 30C/W. Absolute Maximum Ratings Parameter VIN Operating Junction Temperature Range Storage Temperature Range Lead Temperature (Soldering, 10 sec.) 0 -65 Min. Max. 7 125 150 300 Unit V C C C 2 REV. 1.0.3 2/25/02 PRODUCT SPECIFICATION FAN1589 Electrical Characteristics Tj = 25C unless otherwise specified. The * denotes specifications which apply over the specified operating temperature range. Parameter Output Voltage Line Regulation1, 2 Load Regulation1, 2 Dropout Voltage Current Limit Minimum Load Current Quiescent Current Ripple Rejection Thermal Regulation Temperature Stability Long-Term Stability RMS Output Noise (% of VOUT) Thermal Resistance, Junction to Case Thermal Shutdown TA = 125C, 1000 hrs. TA = 25C, 10Hz f 10kHz TO-220 TO-263, TO-252 Conditions 3.3V VIN 7V 10mA IOUT 2.7A (VOUT + 1.5V) VIN 7V, IOUT = 10mA (VIN - VOUT) = 3V 10mA IOUT 2.7A VREF = 1%, IOUT = 2.7A (VIN - VOUT) = 2V 1.5V (VIN - VOUT) 5.75V VIN = 5V f = 120Hz, COUT = 22F Tantalum, (VIN - VOUT) = 3V, IOUT = 2.7A TA = 25C, 30ms pulse * * * * * * * * 60 3.1 10 4 72 0.004 0.5 0.03 0.003 3 3 150 1.0 0.02 13 Min. 1.176 Typ. 1.200 0.005 0.15 1.150 4 Max 1.224 0.2 1.5 1.300 Units V % % V A mA mA dB %/W % % % C/W C/W C Notes: 1. See thermal regulation specifications for changes in output voltage due to heating effects. Load and line regulation are measured at a constant junction temperature by low duty cycle pulse testing. 2. Line and load regulation are guaranteed up to the maximum power dissipation (18W). Power dissipation is determined by input/output differential and the output currrent. Guaranteed maximum output power will not be available over the full input/ output voltage range. REV. 1.0.3 2/25/02 3 FAN1589 PRODUCT SPECIFICATION Typical Performance Characteristics 1.5 0.10 OUTPUT VOLTAGE DEVIATION (%) I = 2.7A 1.4 DROPOUT VOLTAGE (V) 1.3 1.2 1.1 1.0 0.9 T=25C 0.8 0.7 0.6 0.5 0 0.5 1 1.5 2 2.5 3.0 OUTPUT CURRENT (A) T=0C T=125C 0.05 0 -0.05 -0.10 -0.15 -0.20 -75 -50 -25 0 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (C) Figure 1. Dropout Voltage vs. Output Current Figure 2. Load Regulation vs. Temperature 1.225 1.220 REFERENCE VOLTAGE (V) REFERENCE VOLTAGE (V) 1.30 VOUT SET WITH 1% RESISTORS 1.20 1.215 1.210 1.205 1.200 1.195 1.190 1.185 1.180 1.175 -75 -50 -25 0 25 50 75 100 125 150 175 1.10 1.00 0.90 0.80 -75 -50 -25 0 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (C) JUNCTION TEMPERATURE (C) Figure 3. Reference Voltage vs. Temperature Figure 4. Output Voltage vs. Temperature 5 MINIMUM LOAD CURRENT (mA) SHORT-CIRCUIT CURRENT (A) 0 25 50 75 100 125 150 175 5.0 4 4.5 3 4.0 2 3.5 1 0 -75 -50 -25 3.0 -75 -50 -25 0 25 50 75 100 125 150 175 JUNCTION TEMPERATURE (C) JUNCTION TEMPERATURE (C) Figure 5. Minimum Load Current vs. Temperature Figure 6. Short-Circuit Current vs. Temperature 4 REV. 1.0.3 2/25/02 PRODUCT SPECIFICATION FAN1589 Typical Performance Characteristics (continued) 90 80 RIPPLE REJECTIONS (dB) 70 60 50 40 30 20 10 0 10 (VIN - VOUT) 3V 0.5V VRIPPLE 2V IOUT = 2.7A 100 1K FREQUENCY (Hz) 10K 100K 20 15 10 POWER (W) 5 0 50 60 70 80 90 100 110 120 130 140 150 CASE TEMPERATURE (C) Figure 8. Maximum Power Dissipation Figure 7. Ripple Rejection vs. Frequency REV. 1.0.3 2/25/02 5 FAN1589 PRODUCT SPECIFICATION Applications Information General The FAN1589 is a three-terminal regulator optimized for a GTL+ VTT termination applications. It is short-circuit protected, and offers thermal shutdown to turn off the regulator when the junction temperature exceeds about 150C. The FAN1589 provides low dropout voltage and fast transient response. Frequency compensation uses capacitors with low ESR while still maintaining stability. This is critical in addressing the needs of low voltage high speed microprocessor buses like a GTL+. Load Regulation It is not possible to provide true remote load sensing because the FAN1589 is a three-terminal device. Load regulation is limited by the resistance of the wire connecting the regulators to the load. Load regulation per the data sheet specification is measured at the bottom of the package. For fixed voltage devices, negative side sensing is a true Kelvin connection with the ground pin of the device returned to the negative side of the load. This is illustrated in Figure 10. RP PARASITIC LINE RESISTANCE FAN1589 Stability The FAN1589 requires an output capacitor as a part of the frequency compensation. It is recommended to use a 22F solid tantalum or a 100F aluminum electrolytic on the output to ensure stability. The frequency compensation of these devices optimizes the frequency response with low ESR capacitors. In general, it is suggested to use capacitors with an ESR of <1. VIN IN GND OUT RL Figure 10. Connection for Best Load Regulation Thermal Considerations Protection Diodes In normal operation, the FAN1589 does not require any protection diodes. A protection diode between the input and output pins is usually not needed. An internal diode between the input and output pins on the FAN1589 can handle microsecond surge currents of 50A to 100A. Even with large value output capacitors it is difficult to obtain those values of surge currents in normal operation. Only with large values of output capacitance, such as 1000F to 5000F, and with the input pin instantaneously shorted to ground can damage occur. A crowbar circuit at the input can generate those levels of current; a diode from output to input is then recommended, as shown in Figure 9. Usually, normal power supply cycling or system "hot plugging and unplugging" will not generate current large enough to do any damage. As with any IC regulator, exceeding the maximum input-tooutput voltage differential causes the internal transistors to break down and none of the protection circuitry is then functional. D1 1N4002 (OPTIONAL) The FAN1589 protects itself under overload conditions with internal power and thermal limiting circuitry. However, for normal continuous load conditions, do not exceed maximum junction temperature ratings. It is important to consider all sources of thermal resistance from junction-to-ambient. These sources include the junction-to-case resistance, the case-to-heat sink interface resistance, and the heat sink resistance. Thermal resistance specifications have been developed to more accurately reflect device temperature and ensure safe operating temperatures. For example, look at using an FAN1589 to generate 2.7A @ 1.2V 2% from a 3.3V source (3.2V to 3.6V). Assumptions: VIN = 3.6V worst case VOUT = 1.176V worst case IOUT = 2.7A continuous TA = 70C Case-to-Ambient = 3C/W (assuming both a heatsink and a thermally conductive material) The power dissipation in this application is: * * * * * PD = (VIN - VOUT) * (IOUT) = (3.6 - 1.18) * (2.7) = 6.53W From the specification table: FAN1589 VIN C1 10F + IN GND OUT + VOUT C2 22F TJ = TA + (PD) * (Case-to-Ambient + JC) = 70 + (6.53) * (3 + 3) = 109C The junction temperature is below the maximum rating. Figure 9. Optional Protection 6 REV. 1.0.3 2/25/02 PRODUCT SPECIFICATION FAN1589 Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die. This is the lowest resistance path for heat flow. Proper mounting ensures the best thermal flow from this area of the package to the heat sink. Use of a thermally conductive material at the case-to-heat sink interface is recommended. Use a thermally conductive spacer if the case of the device must be electrically isolated and include its contribution to the total thermal resistance. The case of the FAN1589 is directly connected to the output of the device. VIN 3.3V C1 10F U1 FAN1589 VIN + VOUT GND + VOUT 1.2V C3 100F Figure 11. Application Circuit (FAN1589) Table 1. Bill of Materials for Application Circuit for the FAN1589 Item C1 C3 U1 Quantity 1 1 1 Manufacturer Xicon Xicon Fairchild Part Number L10V10 L10V100 FAN1589T Description 10F, 10V Aluminum 100F, 10V Aluminum 2.7A Regulator REV. 1.0.3 2/25/02 7 FAN1589 PRODUCT SPECIFICATION Mechanical Dimensions 3-Lead TO-263 Package Inches Min. A b b2 c2 D E e L L1 L2 R .160 .020 Max. .190 .036 Millimeters Min. 4.06 0.51 Max. 4.83 0.91 Notes: 1. Dimensions are exclusive of mold flash and metal burrs. 2. Standoff-height is measured from lead tip with ref. to Datum -B-. 3. Foot length is measured with ref. to Datum -A- with lead surface (at inner R). 4. Dimensiuon exclusive of dambar protrusion or intrusion. 5. Formed leads to be planar with respect to one another at seating place -C-. Symbol Notes .049 .051 .045 .055 .340 .380 .380 .405 .100 BSC .575 .090 -- .017 0 .625 .110 .055 .019 8 1.25 1.30 1.14 1.40 8.64 9.65 9.65 10.29 2.54 BSC 14.61 2.29 -- 0.43 0 15.88 2.79 1.40 0.78 8 E @PKG/ @HEATSINK L2 c2 D L b2 E-PIN R (2 PLCS) L1 b e -B- -A- A -C- 8 REV. 1.0.3 2/25/02 PRODUCT SPECIFICATION FAN1589 Mechanical Dimensions (continued) 3-Lead TO-263 Center Cut Package Inches Min. A b b2 c2 D E e L L1 L2 L3 R .160 .020 Max. .190 .036 Millimeters Min. 4.06 0.51 Max. 4.83 0.91 Notes: 1. Dimensions are exclusive of mold flash and metal burrs. 2. Standoff-height is measured from lead tip with ref. to Datum -B-. 3. Foot length is measured with ref. to Datum -A- with lead surface (at inner R). 4. Dimensiuon exclusive of dambar protrusion or intrusion. 5. Formed leads to be planar with respect to one another at seating place -C-. Symbol Notes .049 .051 .045 .055 .340 .380 .380 .405 .100 BSC .575 .090 -- .050 .017 0 .625 .110 .055 .070 .019 8 1.25 1.30 1.14 1.40 8.64 9.65 9.65 10.29 2.54 BSC 14.61 2.29 -- 1.27 0.43 0 15.88 2.79 1.40 1.78 0.78 8 E @PKG/ @HEATSINK L2 c2 D L b2 E-PIN R (2 PLCS) L1 L3 b e -B- -A- A -C- REV. 1.0.3 2/25/02 9 FAN1589 PRODUCT SPECIFICATION Mechanical Dimensions (continued) 3-Lead TO-220 Package Inches Min. A b b1 c1 oP D E e e1 e3 F H1 J1 L L1 Q Max. Millimeters Min. Max. Symbol Notes .140 .190 .015 .040 .045 .070 .014 .022 .139 .161 .560 .650 .380 .420 .090 .110 .190 .210 .045 -- .020 .055 .230 .270 .080 .115 .500 .580 .250 BSC .100 .135 3 7 3.56 4.83 .38 1.02 1.14 1.78 .36 .56 3.53 4.09 14.22 16.51 9.65 10.67 2.29 2.79 4.83 5.33 1.14 -- .51 1.40 5.94 6.87 2.04 2.92 12.70 14.73 6.35 BSC 2.54 3.43 3 7 Notes: 1. Dimension c1 apply for lead finish. H1 L e3 e e1 E b1 Q b L1 E-PIN oP (5X) c1 J1 D A F 10 REV. 1.0.3 2/25/02 PRODUCT SPECIFICATION FAN1589 Mechanical Dimensions (continued) 3-Lead TO-252 Package Symbol A b b2 b3 c c2 D E e H L L1 L3 L4 Inches Min. .086 .025 .030 .205 .018 .018 Max. .094 .035 .045 .215 .024 .023 Millimeters Min. 2.19 0.64 0.76 5.21 0.46 0.46 Max. 2.39 0.89 1.14 5.46 0.61 0.58 4 Notes: Notes 1. 2. 3. 4. 5. 1 1 6. Dimensions are exclusive of mold flash, metal burrs or interlead protrusion. Stand off-height is measured from lead tip with ref. to Datum -B-. Foot length is measured with ref. to Datum -A- with lead surface. Thermal pad contour optional within dimension b3 and L3. Formed leads to be planar with respect to one another at seating place -C-. Dimensions and tolerances per ASME Y14.5M-1994. .210 .245 .250 .265 .090 BSC .370 .410 .055 .070 .108 REF .035 .025 .080 .040 5.33 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.89 0.64 2.03 1.02 3 4 E @PKG/ @HEATSINK b3 L3 c2 D H b2 E-PIN L4 L1 L b e = 0 - 10 -A- -B- A -C- REV. 1.0.3 2/25/02 11 FAN1589 PRODUCT SPECIFICATION Ordering Information Product Number FAN1589MX FAN1589MCX FAN1589T FAN1589DX Package TO-263 in tape and reel TO-263 center cut in tape and reel TO-220 TO-252 in tape and reel DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 2/25/02 0.0m 004 Stock#DS30001589 2002 Fairchild Semiconductor Corporation |
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